In:
11th International IEEE Conference on Industrial Informatics 2013, IEEE
Scalability of OPC-UA Down to the Chip Level Enables "Internet of Things"
Jul 2013
Literatur Beschaffung:
11th International IEEE Conference on Industrial Informatics 2013, IEEE
Bibtex: Download Bibtex
@inproceedings{1447,
}
| author | = | {}, |
| title | = | {Scalability of OPC-UA Down to the Chip Level Enables "Internet of Things"}, |
| booktitle | = | {11th International IEEE Conference on Industrial Informatics 2013}, |
| year | = | {2013}, |
| editor | = | {}, |
| volume | = | {}, |
| series | = | {}, |
| pages | = | {}, |
| address | = | {Bochum, Deutschland}, |
| month | = | {Jul}, |
| organisation | = | {}, |
| publisher | = | {IEEE}, |
| note | = | {}, |